Acronics has the ability to build virtually all multilayer board designs produced in the world. We’ve aligned with the best fabrication companies to successfully fabricate printed circuit boards with quality and speed.

  • Multilayer Technologies
  • High Performance Materials
  • Microvia
  • QTA and Prototyping
  • MCM/Substrates
  • Backpanels


  • Ranging from 24 hours to 5 days for prototypes depending upon board complexity
  • Prototyping and quickly spinning revisions to get to production ready as fast as possible


While our PCB capabilities vary by site, a large spectrum of products can be produced within the global footprint. We offer a wide range of applications from double sided boards to multi-layers.

  • Up to 32 layers
  • 0.008″ to 0.300″ thickness
  • 2/2 trace/space (4/4 standard)
  • Impedance control (5% tolerance) and Controlled Dielectrics
  • Blind, buried, stacked, plugged vias
  • Selective Plating
  • Various materials: FR-4, High Temp Fr-4, Roger, Isola, Getek, etc…
  • RoHS Compliant


Acronics has extensive experience with materials, ranging from mid-range FR-4, High Temp Fr-4 to Polyimide, Rogers, Megtron, Getek, Teflon, Cynate Ester and BT. Hybrid application for complex RF, Microwave, and Antenna products are our specialty. The use of High Tg, Low loss high speed Dielectrics is growing with the increasing functionality and speed for the character, voice and image path transition. Thin core capability exists around the world. Acronics can provide alternative solutions for hard to find materials based on desired electrical performance requirements.